XMOS Partners with DSP Concepts to Accelerate Audio and Voice DSP Applications Development¶
Artificial intelligence and chip supplier XMOS announced a partnership with embedded audio software experts, DSP Concepts.This collaboration will enable audio developers to marry XMOS's highly deterministic, low latency xcore.ai platform with DSP Concepts' Audio Weaver software. This software allows users to graphically design and debug audio and voice solutions leveraging multi-cores. xcore.ai, integrating edge AI, DSP, control, and IO into a single device, is a high-performance, versatile processor specifically designed for smart IoT. It is entirely configurable in software and according to XMOS, it offers a cost-effective multi-functional platform for IoT products to reach the market swiftly.
DSP's Audio Weaver provides a one-stop solution for audio product development from R&D to production. It combines intricate graphical design tools with over 500 pre-built models, meaning designers can construct audio processing pipelines graphically, with virtually no need for complex manual coding.
Audio Weaver makes the coding process a drag-and-drop operation, and xcore.ai allows for complete customizability merely through software. The combination of these two solutions will provide a higher level of flexibility and accessibility in designing audio and voice products, while reducing BOM costs and accelerating time to market.
Engineers can leverage this combination through XMOS's xcore.ai multi-channel audio evaluation board and a fully productized software development kit (SDK) driven by customers.
It also brings together the strong support networks and engineering communities of both platforms.
DSP Concepts CEO, Chin Beckmann, stated: "Audio innovation needs to be made easier so audio engineers can focus on the differentiation of the products they are creating. Audio Weaver is designed to simplify the design process. Visual methods, multiple deployment options, and deep integration with chip partners all contribute to focusing attention on the product rather than the frustrating development process. XMOS's adaptability will enhance this benefit."
XMOS's Executive Vice President of Marketing and Product Management, Aneet Chopra, added: "There are numerous market opportunities in the IoT field, and versatility has always been XMOS's top priority—designers and engineers need to be able to alter their designs and explore new ideas unhindered. The collaboration with DSP Concepts is the latest milestone
XMOS China Contact: Wilson Xiao(Application Solution and Business Cooperation - Senior Manager)
Email: Wilsonxiao@Xmos.com
Phaten XMOS Solution Contact:
Allen Su
Email: hua@phaten.com